Precision BGA PCB Assembly with 0.25 mm Pitch, X-ray Inspection, and Nitrogen Reflow for High-Quality Solder Joints

Precision BGA PCB Assembly (0.25 mm Pitch)

Huayihai provides BGA PCB assembly for packages with ball pitches down to 0.25 mm. Because BGA joints sit underneath the package, assembly quality depends on placement accuracy, a controlled reflow profile, and inspection that can actually see the joints — which is why BGA joints are verified by X-ray inspection because the solder joints are hidden beneath the package.

BGA assembly runs with placement accuracy of ±0.025 mm and nitrogen reflow soldering, followed by X-ray inspection of ball joints and, where required, BGA rework for correction. Boards are built according to customer Gerber files, BOM, and technical specifications.

Custom Manufacturing Only

We provide BGA PCB assembly according to customer Gerber files, BOM, and technical specifications. We do not supply ready-made or standard products.

Service Specifications

Key Features

• BGA placement down to 0.25 mm ball pitch

• ±0.025 mm placement accuracy

• Nitrogen reflow for controlled BGA joint formation

• X-ray inspection of every BGA build

• BGA rework capability for repair and correction

• 100% electrical testing on every assembly

Manufacturing Highlights

BGA joints cannot be judged visually — they are verified by X-ray. Huayihai's BGA process pairs precision placement and nitrogen reflow with X-ray inspection, so X-ray inspection helps identify common BGA solder joint conditions such as bridges, voids, and open connections before shipment.

Key service elements include:

• Placement of BGA packages down to 0.25 mm pitch

• Nitrogen reflow with profiles matched to the package

• X-ray inspection of ball joints

• BGA rework for component replacement and joint repair

• 100% electrical testing with flying probe or test fixtures

Typical Applications

BGA assembly supports designs that use high-pin-count packages:

• Communication Equipment

• Industrial Control Equipment

• Medical Device Electronics

• Automotive Electronic Modules

• Data Processing Boards

• Other BGA Assembly Projects

Why Choose Huayihai

• Over 20 years of PCB and PCBA manufacturing experience

• 0.25 mm BGA pitch with ±0.025 mm placement accuracy

• X-ray inspection and BGA rework capability

• Quality management based on ISO 9001, ISO 13485, IATF 16949 and UL

• PCB fabrication and assembly available from one partner

• Prototype, low-volume, and mass production support

Manufacturing Process

• Gerber file, BOM, and engineering drawing review

• Solder paste printing and 3D-SPI inspection

• BGA placement (±0.025 mm)

• Nitrogen reflow soldering

• X-ray inspection of BGA joints

• BGA rework where required

• 100% electrical testing and final inspection

FAQ

Q1: What BGA pitch can you assemble?

Down to 0.25 mm ball pitch.

Q2: How are BGA joints inspected?

By X-ray, since the joints are underneath the package.

Q3: Can a defective BGA be repaired?

Yes, BGA rework capability covers component replacement and joint repair.

Q4: Why nitrogen reflow for BGA?

Nitrogen reduces oxidation during reflow, supporting cleaner, more consistent ball joints.

Q5: What is the standard lead time?

3–5 working days for samples and small batches, after file review is complete.

Q6: Can you assemble fine-pitch BGAs?

Yes. We support BGA assembly down to 0.25 mm pitch according to customer design requirements.

Q7: Can BGA assembly be combined with PCB fabrication?

Yes. Huayihai can manufacture the PCB and complete BGA assembly under the same production process.

Request a Quote

Need BGA assembly with X-ray verification and rework capability?

Send us your Gerber files, BOM, and specifications for a quotation. Learn more at nexuspcba.com.