Custom SMT PCB Assembly with 01005 Placement, ±0.025 mm Accuracy, and Nitrogen Reflow Soldering

Custom SMT PCB Assembly (01005 and Fine Pitch)

Huayihai provides SMT PCB assembly for OEM customers, from prototype builds to stable volume production. Boards are assembled according to customer Gerber files, BOM, and technical specifications, with placement down to 01005 components and accuracy of ±0.025 mm.

SMT assembly at Huayihai runs with solder paste inspection (3D SPI) before placement, nitrogen reflow soldering for reliable joints, and AOI plus 3D-AOI after reflow — so every solder joint is checked where it matters in the process. Through-hole work (wave, selective wave, DIP) is handled on the same line sequence.

Custom Manufacturing Only

We provide SMT PCB assembly according to customer Gerber files, BOM, and technical specifications. We do not supply ready-made or standard products.

Service Specifications

Key Features

• 01005 placement with ±0.025 mm accuracy

• BGA 0.25 mm, QFP 0.30 mm, QFN 0.50 mm fine pitch capability

• 3D SPI before placement and AOI / 3D-AOI after reflow

• Nitrogen reflow soldering for consistent joints

• X-ray inspection where required for hidden joints such as BGAs

• 100% electrical testing on every assembly

Manufacturing Highlights

SMT assembly quality is decided at the process checkpoints: paste volume, placement accuracy, and reflow profile. Huayihai controls each stage through 3D SPI, precision placement, nitrogen reflow, AOI, X-ray, and electrical testing — 3D-SPI on paste, ±0.025 mm placement, nitrogen reflow — then verifies the result by AOI, X-ray, and electrical test.

Key service elements include:

• Solder paste inspection (3D-SPI) before placement

• Placement down to 01005 with ±0.025 mm accuracy

• Nitrogen reflow soldering

• AOI, 3D-AOI, and X-ray inspection

• BGA rework capability for correction and repair

• 100% electrical testing with flying probe or test fixtures

Typical Applications

SMT assembly supports OEM products across industries:

• Industrial Control Equipment

• Communication Equipment

• Automotive Electronics

• Medical Devices

• IoT Devices

• Other SMT Assembly Projects

Why Choose Huayihai

• Over 20 years of PCB and PCBA manufacturing experience

• 01005 and fine pitch placement with ±0.025 mm accuracy

• Instrumented process: 3D-SPI, AOI, 3D-AOI, X-ray

• Quality management based on ISO 9001, ISO 13485, IATF 16949 and UL

• PCB fabrication and assembly available from one partner

• Prototype, low-volume, and mass production support

Manufacturing Process

• Gerber file, BOM, and engineering drawing review

• Solder paste printing and 3D-SPI inspection

• Component placement (±0.025 mm)

• Nitrogen reflow soldering

• AOI and 3D-AOI inspection

• X-ray for BGA and hidden joints

• 100% electrical testing and final inspection

FAQ

Q1: What is the smallest component you can place?

01005 components, with placement accuracy of ±0.025 mm.

Q2: Which fine pitch packages are supported?

BGA 0.25 mm, QFP 0.30 mm, and QFN 0.50 mm.

Q3: How are solder joints verified?

3D-SPI on paste, AOI and 3D-AOI after reflow, and X-ray for BGA and hidden joints.

Q4: What board sizes can be assembled?

50 × 50 mm to 900 × 600 mm, thickness 0.5 – 6.0 mm.

Q5: What is the standard lead time?

3–5 working days for samples and small batches, after file review is complete.

Q6: Can SMT assembly include PCB fabrication?

Yes. Huayihai can manufacture the PCB and complete SMT assembly under the same production process.

Q7: Do you support prototype and mass production?

Yes. We support prototype builds, low-volume production, and stable volume manufacturing.

Request a Quote

Need SMT assembly with 01005 and fine pitch capability?

Send us your Gerber files, BOM, and specifications for a quotation. Learn more at nexuspcba.com.