Custom HDI PCB Fabrication with 2+N+2 Stack-Up and 3 mil Laser Microvias

Custom HDI PCB (Up to 2+N+2)

Huayihai fabricates custom HDI (High Density Interconnect) PCBs for compact, high-density electronic designs. Boards are built according to customer Gerber files, with laser microvias down to 3 mil and sequential lamination stack-ups up to 2+n+2.

HDI technology allows finer lines, smaller vias, and higher component density than conventional multilayer construction — the foundation for miniaturized products such as communication modules, portable devices, and advanced automotive modules. All HDI boards are manufactured under IPC-A-600 workmanship standards.

Custom Manufacturing Only

We fabricate HDI PCBs according to customer Gerber files and technical specifications. We do not supply ready-made or standard stock boards.

Product Specifications

Key Features

• HDI stack-ups up to 2+n+2

• Laser microvias down to 3 mil

• Blind, buried, and via-in-pad structures with copper paste plugging

• 3/3 mil trace width and spacing

• RCC and low-loss material options for build-up layers

• Manufactured under IPC-A-600 workmanship standards

Manufacturing Highlights

HDI fabrication at Huayihai combines laser drilling, sequential lamination, and fine-line imaging under one quality process, so dense interconnect designs move from prototype to volume without requalification.

Key fabrication elements include:

• Stack-up and DFM review of Gerber files before production

• Laser drilling of 3 mil microvias

• Sequential lamination for 1+n+1 and 2+n+2 builds

• Via filling and capping (copper paste available)

• Controlled impedance verification with ±5% tolerance

• 100% electrical testing before shipment

Typical Applications

HDI PCBs serve products where component density and board space are critical:

• Communication Modules

• Portable and Wearable Devices

• Automotive Driver Assistance Modules

• Medical Device Electronics

• IoT Devices

• Other High-Density Applications

Why Choose Huayihai

• Over 20 years of PCB manufacturing experience

• Laser microvia capability down to 3 mil

• HDI stack-ups up to 2+n+2

• Quality management based on ISO 9001, ISO 13485, IATF 16949 and UL

• IPC-A-600 workmanship standards

• Prototype, low-volume, and mass production support

Manufacturing Process

• Gerber file and stack-up review

• Core layer fabrication

• Laser drilling of microvias

• Via plugging and capping

• Sequential lamination (build-up layers)

• Fine-line imaging (3/3 mil)

• Surface finish and electrical testing

FAQ

Q1: What HDI stack-ups does Huayihai support?

Build-ups up to 2+n+2, including 1+n+1 constructions.

Q2: What is the minimum laser via size?

3 mil laser microvias.

Q3: Can vias be filled?

Yes, via-in-pad with copper paste plugging is available.

Q4: What materials are used for HDI builds?

FR-4, Hi-Tg, RCC, Rogers, and hybrid stack-ups per customer requirement.

Q5: What is the standard lead time?

3–5 working days for PCB prototypes and batches, after file review is complete.

Request a Quote

Need custom HDI PCBs with laser microvias and sequential lamination?

Send us your Gerber files and specifications for a quotation. Learn more at nexuspcba.com.