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Found 37 products for "8 layer printed circuit board"
Quality SMT Assembly Flexible PCB Immersion Gold Surface Plating 1.0MM Board Thickness factory

SMT Assembly Flexible PCB Immersion Gold Surface Plating 1.0MM Board Thickness

SMT Flexible PCB with yellow overlay, 1-6oz copper weight, FR-4/Alu/RoHS/Rogers base materials, immersion gold plating, 1.0MM or 2.0MM thickness, CNC finish, and 1*1 panel. Ideal for flexible electronic circuitry with custom PCB board options.
Quality Immersion Gold Surface Plating Flexible PCB CNC Finish SMT Assembly Method factory

Immersion Gold Surface Plating Flexible PCB CNC Finish SMT Assembly Method

Immersion Gold Surface Plating Flexible PCB with CNC finish and SMT assembly. Features 1-6oz copper weight, ±0.1mm outline tolerance, 2.0mm board thickness, and impedance control. Certified with ISO9001, ISO14001, ISO13485, UL, and RoHS. Customizable with various solder mask colors and flexible order quantities from 1 unit.
Quality PCB Manufacturing HASL Pb Free Surface Finish 0.8mm Board Thickness Copper 0.5 to 10OZ factory

PCB Manufacturing HASL Pb Free Surface Finish 0.8mm Board Thickness Copper 0.5 to 10OZ

FPC Boards PCB Manufacturing offers HASL Pb Free, Immersion Gold, and OSP surface finishes with copper thickness from 0.5 to 10OZ. Features include laser hole filling, 0.8mm board thickness, 20:1 aspect ratio, and 3-15 day lead time. Ideal for custom industrial applications requiring precision and durability.
Quality Custom PCB Assembly Flying Probe Test 0.2-0.5um OSP Finish 700x460mm Max PCB Size factory

Custom PCB Assembly Flying Probe Test 0.2-0.5um OSP Finish 700x460mm Max PCB Size

Custom PCB Assembly with Flying Probe Test & OSP 0.2-0.5um finish. Supports 1-48 layers, max size 700*460mm, SMT/Thru-hole/DIP assembly. Turnkey PCBA solution with component sourcing, IPC/ISO/RoHS certified quality.
Quality 6 Layer HDI PCB with High-Density Interconnect for Compact Board Structure in Electronic Applications factory

6 Layer HDI PCB with High-Density Interconnect for Compact Board Structure in Electronic Applications

6 Layer HDI PCB manufactured for high-density electronic designs, with advanced interconnect technology, fine routing capability, and reliable signal performance.
Quality 12 Layer HDI PCB with High-Density Interconnections and Customizable Manufacturing for Complex Electronics factory

12 Layer HDI PCB with High-Density Interconnections and Customizable Manufacturing for Complex Electronics

12 Layer HDI PCB for complex high-density circuit designs, providing increased routing capacity and reliable multilayer interconnection for advanced electronics.
Quality Prototype PCB Assembly ENIG Surface Finish 1 Oz Copper Weight Via Diameter 0.20-0.30mm factory

Prototype PCB Assembly ENIG Surface Finish 1 Oz Copper Weight Via Diameter 0.20-0.30mm

Prototype PCB Assembly with 2–12 layers, 1 Oz copper, and ENIG surface finish. Options include Rigid, Flexible, Rigid-Flex PCBs and full PCBA. Features CNC/V-Cut PCB cutting, AOI/X-Ray/ICT testing, and 0.20–0.30 mm via diameter for industrial and electronic applications.
Quality Custom Aluminum PCB Efficient Heat Dissipation Multiple Surface Finish Options Thermal Management factory

Custom Aluminum PCB Efficient Heat Dissipation Multiple Surface Finish Options Thermal Management

Custom Aluminum PCB Manufacturing with ISO9001, RoHS, UL certifications. Features aluminum core construction, 1-4 layers, 1-6 oz copper thickness, and excellent thermal conductivity (1.0-3.0 W/m·K). Ideal for LED lighting, power electronics, and automotive applications requiring efficient heat dissipation.
Quality HASL ENIG OSP Surface Finishing SMT Assembly 0402 to 1206 Component Size Prototype Mass Production factory

HASL ENIG OSP Surface Finishing SMT Assembly 0402 to 1206 Component Size Prototype Mass Production

SMT Assembly for PCB prototype & mass production. Surface finishing: HASL, ENIG, OSP. Supports Gerber/BOM files. ISO 9001, IPC-A-610 certified. Standard/expedited lead times available.