Huayihai Strengthens BGA Rework and Multi-cycle Repair Capabilities to Support Fast Recovery of High-Value Boards
2026/07/06
BGA (Ball Grid Array) rework is a common challenge in the PCBA manufacturing process, especially on high-density and complex boards. Huayihai has enhanced its BGA rework capabilities by introducing X-ray inspection technology, controlled heating profiles, and secondary ball placement processes. This allows the company to provide multi-cycle rework for BGA devices, ensuring high-quality repair services, particularly for industrial control boards and high-end power systems, thus extending product lifecycles and minimizing client losses.
