Mixed Technology PCB Assembly (SMT + Through-Hole)

Mixed Technology PCB Assembly (SMT + Through-Hole)

Huayihai provides mixed technology PCB assembly for boards that combine surface-mount and through-hole components — the most common construction in industrial and power electronics. Assemblies are built according to customer Gerber files, BOM, and technical specifications.

Both stages run in one factory and one schedule: SMT placement with nitrogen reflow on one line, then DIP insertion and wave or selective wave soldering on the next. Boards move through inspection and 100% electrical testing as a single order, so there is no coordination gap between suppliers.

Custom Manufacturing Only

We provide mixed technology PCB assembly according to customer Gerber files, BOM, and technical specifications. We do not supply ready-made or standard products.

Service Specifications

Key Features

• SMT and through-hole processes on one board, in one factory

• 01005 SMT placement with nitrogen reflow

• Wave and selective wave soldering for leaded parts

• 3D-SPI, AOI, 3D-AOI, and X-ray across both stages

• 100% electrical testing on every board

• One schedule from file review to shipment

Manufacturing Highlights

Mixed technology boards are where process sequencing matters most: paste printing, reflow, insertion, and wave soldering must be ordered and controlled so neither stage damages the other. At Huayihai, both stages run under the same engineering review and quality gates.

Key service elements include:

• Process sequencing planned during engineering review

• SMT stage: 3D SPI, placement, nitrogen reflow, AOI

• Through-hole stage: DIP insertion, wave or selective wave soldering

• X-ray inspection of fine pitch and BGA joints

• 100% electrical testing before shipment

Typical Applications

Mixed assembly fits boards that combine fine-pitch ICs with power or connector parts:

• Industrial Control Systems

• Power Electronics and Drives

• Automotive Electronic Control Units

• Communication Equipment

• Medical Devices

• Other Mixed Technology Assembly Projects

Why Choose Huayihai

• Over 20 years of PCB and PCBA manufacturing experience

• SMT and through-hole in one factory, one schedule

• Fine pitch capability down to 0.25 mm BGA

• 100% electrical testing on every board

• PCB fabrication and assembly available from one partner

• Quality management based on ISO 9001, ISO 13485, IATF 16949 and UL

Manufacturing Process

• Gerber file, BOM, and engineering drawing review

• Component preparation and verification

• SMT stage: 3D SPI, placement, nitrogen reflow, AOI

• Through-hole stage: DIP insertion, wave or selective wave soldering

• X-ray inspection and 100% electrical testing

• Final inspection and shipment

FAQ

Q1: Do mixed technology boards cost more to assemble?

They require two soldering stages, so assembly time is higher than SMT-only boards; send your files for a specific quotation.

Q2: Which stage runs first?

Typically SMT first, then through-hole insertion and wave soldering — sequenced during engineering review based on your board.

Q3: Can BGA and through-hole parts coexist on one board?

Yes; BGA joints are verified by X-ray inspection.

Q4: What files are required to start?

Gerber files, the BOM, technical specifications, and quantity requirements.

Q5: What is the standard lead time?

3–5 working days for samples and small batches, after file review is complete.

Request a Quote

Have a board that needs both SMT and through-hole?

Send us your Gerber files, BOM, and quantity for a quotation. Learn more at nexuspcba.com.